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device operating temperature range package ordering information mc34055dw t a = 0 to +70 c so24l semiconductor technical data 10baset transceiver pin connections clk out tx data a tx data b tx en h ana. gnd clk+ sqe en l tx pwr v cc fulld l rx data a rx data b rx+ rx en h rx dig. gnd pwr gnd tx+ clk loop l ctl h lnkfl h jabb h v cc (dig/ana) dw suffix plastic package case 751e (so24l) 24 1 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 790 motorola analog ic device data
the motorola 10baset transceiver, designed to comply with the iso 88023 [ieee 802.3] 10baset specification, will support a medium dependent interface (mdi) in an embedded media attachment unit (mau)*. the interface supporting the data terminal equipment (dte) is ttl, cmos, and raised ecl compatible, and the interface to the twisted pair (tp) media is supported through standard 10baset filters and transformers. differential data intended for the tp media is provided a 50 ns preemphasis and data at the tp receiver is screened by smart squelch circuitry for specific threshold, pulse width, and sequence requirements. other features of the mc34055 include: collision and jabber detection status outputs, select mode pins for forcing loop back and fullduplex operation, a signal quality error pin for testing the collision detect circuitry without affecting the tp output, and a led driver for link integrity status. an onchip oscillator, capable of receiving a clock input or operating under crystal control, is also provided for internal timing and driving a buffered clock output. the mc34055 is manufactured on a bicmos process and is packaged in a 24 pin soic. ? bicmos technology for low power operation ? standard 5.0 v, 5% voltage supply ? smart squelch enforcement of threshold, pulse width, and sequence requirements ? driver preemphasis for output data ? ttl, cmos and raised ecl compatible ? interfaces to tp media with standard 10baset filters and transformers ? led capable status outputs for collision, jabber detection, and link integrity ? directly driven or crystal controlled clock oscillator ? selectable fullduplex operation ? signal quality error test pin ? selectable loop back maximum ratings (t a = 25 c, unless otherwise noted.) rating symbol value unit power supply voltage v cc 0.5 to 7.0 vdc differential voltage at rx+/rx v id 5.25 to 5.25 vdc voltage applied to logic and mode/test select inputs 0.5 to 5.5 vdc voltage applied to logic outputs and output status pins 0.5 to 7.0 vdc ambient operating temperature range t a 0 to 70 c junction temperature t j 65 to 150 c note: devices should not be operated at these limits. the arecommended operating conditionso table provides for actual device operation.
mc34055 791 motorola analog ic device data link pulse collision announcement 10mhz sqe en l lnkfl h ana. gnd v cc fulld l rx rx+ loop l tx tx+ balun filter filter rx en h rx data b rx data a tx en h tx data b tx data a ctl h jabb h clk out clk clk + dig. gnd pwr gnd v cc (dig/ana) pwr v cc ttl/cmos ttl/cmos ttl/cmos ttl/cmos ttl/cmos ecl ttl/cmos ttl/cmos ecl cmos collision test data in data out full duplex disable link fail disable jabber disable loop back collision detect tp differential receiver with smart squelch duplex mode select link beat control clock oscillator ttl/cmos signal quality error jabber collision detect outputs received data output and control transmit input and control transmit idle timer driver preemphasis tp differential driver and control simplified block diagram v cc v cc *the sale and use of this product is licensed * under technology covered by one or more * digital equipment corporation patents. this device contains 9,875 active transistors. recommended operating conditions characteristic symbol min typ max unit power supply voltage v cc 4.75 5.0 5.25 vdc voltage applied to logic inputs and status pins 0 5.25 vdc differential input voltage 0.59 2.8 vpp operating ambient temperature t a 0 70 c note: all limits are not necessarily functional concurrently. electrical characteristics (0 c t a 70 c, v cc = 5.0 v, unless otherwise noted.) characteristic symbol min typ max unit supply current (4.75 v v cc 5.25 v) i cc 60 180 ma reset circuit threshold 4.0 4.4 vdc twisted pair transmitter output differential voltage (see load circuits: differential load circuit) v o vpp output differential voltage with preemphasis 2.2 2.53 2.8 output differential voltage 1.56 1.72 1.98 common mode driver impedance z ocm 6.0 8.5 14 w transmitter differential output impedance z od 8.0 15.5 29 w tx data a input high voltage (i ih = + 20 m a) v ih 3.15 5.25 vdc input low voltage (i il = 150 m a) v il 0 0.8 tx data b input voltage (see load circuits: ecl load circuit) vdc high: @ 0 c v ih 0.984 v cc 0.923 0.984 v cc 0.763 @ 25 c 0.984 v cc 0.877 0.984 v cc 0.727 @ 70 c 0.984 v cc 0.825 0.984 v cc 0.644 low: @ 0 c v il 0.750 v cc 0.568 0.750 v cc 0.361 @ 25 c 0.750 v cc 0.550 0.750 v cc 0.350 @ 70 c 0.750 v cc 0.531 0.750 v cc 0.324
mc34055 792 motorola analog ic device data electrical characteristics (0 c t a 70 c, v cc = 5.0 v, unless otherwise noted.) characteristic symbol min typ max unit tx en h input high voltage (i ih = 200 m a) v ih 2.0 5.0 vdc input low voltage (i il = 20 m a) v il 0 0.8 rx data a/rx en h/jabb h/ctl h output voltage (see load circuits: cmos load circuit) vdc high (i oh = 12 ma) v oh 3.7 low (i ol = +16 ma) v ol 0.5 rx data b output voltage (see load circuits: ecl load circuit) vdc high: @ 0 c v oh 0.984 v cc 0.923 0.984 v cc 0.763 @ 25 c 0.984 v cc 0.877 0.984 v cc 0.727 @ 70 c 0.984 v cc 0.825 0.984 v cc 0.644 low: @ 0 c v ol 0.750 v cc 0.568 0.750 v cc 0.361 @ 25 c 0.750 v cc 0.550 0.750 v cc 0.350 @ 70 c 0.750 v cc 0.531 0.750 v cc 0.324 signal quality error test enable control (sqe en l) test control voltage vdc test disabled (input high voltage)(i ih = + 20 m a max.) v ih 2.0 5.0 test enabled (input low voltage)( 50 m a < i il < 150 m a) v il 0 0.8 full duplex mode select (fulld l) mode select control voltage vdc normal operation (input high)(i ih = + 20 m a) v ih 2.0 5.0 full duplex (input low)( 50 m a < i ih < 150 m a) v il 0 0.8 loopback test mode function (loop l) test control voltage vdc test disabled (input high)(i ih = + 20 m a) v ih 2.0 5.0 test enabled (input low)(i il = 200 m a) v il 0 0.8 link fail status (linkfl h) status output voltage (see load circuits: cmos load circuit) maximum voltage for output low condition (i ol = 20 ma) v oh 0.5 vdc output low sink current v ol 20 ma clock oscillator clk+ input logic threshold high level input voltage (i ih = +100 m a max.) v ih 2.0 5.0 vdc logic low input voltage (i il = 100 m a max.) v il 0.8 m a clk out output voltage (see load circuits: cmos load circuit) vdc logic high (i oh = 12 ma) v oh 3.7 3.9 logic low (i out = +16 m a) v ol 0.25 0.5 output load circuits ttl/cmos load circuit 6.0k w 20 pf ecl load circuit 330 w 15 pf differential load circuit 100 w tx tx+ 39 (1%) 39 (1%) v od
mc34055 793 motorola analog ic device data timing characteristics (0 c t a 70 c) characteristic symbol min typ max unit transmit start timing tx en h to tx+/tx enable time t txen 75 ns tx data a/b to tx+/tx enable time t fdxd 75 ns steady state propagation delay of tx data a/b to tx+/tx output t txss 75 ns preemphasis pulse width t prcm 45 55 ns transmitter caused edge skew between tx+ and tx t skew t 2.0 ns transmitter added edge jitter to tx+/tx from tx data a/b t jitter t 4.0 ns steadystate delay between the tx data a/b input to the rx data a/b outputs for normal operation t txrx 50 ns tx en h assert to rx en h assert under normal operation t drel 50 ns transmit stop timing delay between tx en h low and tx+/tx high t txdh 75 ns tx en h assert/deassert delay from tx en h to rx en h assert/deassert t xtre 400 ns end of packet hold time from last tx data a/b edge or tx en h deassert t tddc 250 ns link beat pulses output link test pulse width t lkpw 80 120 ns minimum link beat pulse duration on rx+/rx t ldcy_a 80 192 ns loop back mode timing delay from loop l deassertion to rx en h driven from tx en h status t ltra 30 ns tx en h assert/deassert to rx en h, assert/deassert when in loopback mode and receiver inactive t ltrx 50 ns steadystate tx data a/b to rx data a/b when in loopback mode t ltrd 50 ns smart squelch interval unit squelch deactivation t sq 5.0 bit times receive start timing receiveradded edge skew to rx data a/b signal t skew r 1.5 ns receiveradded edge jitter to rx data a/b signal t jitter r 1.5 ns startup delay from rx+/rx to rx data a/b t rxne 50 ns delay from rx en h assertion until rx data a/b valid t rare 10 +10 ns steadystate propagation delay from rx+/rx data a/b t rxss 50 ns receive shutdown timing last received data edge until the rx en h output forces low t rxde 155 250 ns
mc34055 794 motorola analog ic device data figure 1. start up and steady state transmit timing t skew t t txss t jitter t t txen rx en h tx+/tx t drel t prcm bit pattern 0 1 0 1 rx data a/b tx data a/b tx en h t txrx figure 2. driver shutdown timing t xtre t tddc t txdh rx en h tx en h 585mv tx+/tx 0 1 bit pattern tx data a/b figure 3. link pulse timing t lkpw t ldcy_a tx+/tx rx+/rx 585mv 585mv
mc34055 795 motorola analog ic device data figure 4. loop back timing figure 5. receive startup timing figure 6. receive shutdown timing t ltra t ltrx t ltrd loop l rx en h bit pattern 1 0 1 rx data a/b tx data a/b tx en h t jitter r t skew r t rare t rxss t rxne t sq rx data a/b 1 0 rx+/rx rx en h 1 0 1 0 rx+/rx rx en h t rxde
mc34055 796 motorola analog ic device data pin function description pin symbol description 1 clk out ttl/cmos buffered 10 mhz clock output. this pin will source 400 m a and sink 16 ma. 2 tx data a cmos transmit input pin. data input at this pin is output to the tp media. the input will source less than 175 m a and sink less than 20 m a. 3 tx data b raised ecl transmit input pin. data input at this pin is output to the tp media. the input can source 40 m a for a high level input or 70 m a for a low level input. 4 tx en h ttl/cmos transmit enable pin. transmit is enabled when asserted high. the input will source less than 175 m a and sink less than 20 m a. 5 dig. gnd digital ground 6 v cc (dig/ana) digital and analog v cc . with the current consumed at this pin and pin 18, the device will consume less than 180 ma at 5.0 vdc. 7 ana. gnd analog ground 8 rx data a ttl/cmos received data output pin. data from the tp media is output at this pin. the output will source 12 ma and sink 16 ma. 9 rx data b raised ecl received data output pin. data from the tp media is output at this pin. 10 rx en h ttl/cmos received data output enable pin. this pin is asserted after the smart squelch circuitry determines that there is valid data at the tp input pins and also when internal loopback is occurring. the output will source 12 ma and sink 16 ma. the receive data outputs are forced high when this pin is low. 11 loop l ttl/cmos loopback test select. asserting this pin causes the transmit data to be looped to the receive circuit while the tp transmit driver sends a link pulse. the input will source less than 175 m a and sink less than 20 m a. 12 lnkfl h this pin is driven high to indicate a link fail state. when low, the pin will sink 20 ma to light an led. an usquelched condition due to valid data on the receive circuit will cause the pin to transition high and low in 100 ms intervals. 13 jabb h ttl/cmos jabber status pin. this pin is asserted when a jabber condition is detected and will source 12 ma and sink 16 ma. 14 ctl h ttl/cmos status pin. this pin pulled high when jabber or collision conditions are detected. also high for a time interval when a signal quality error test is being performed. the pin will source 12 ma and sink 16 ma. 15 rx the inverting terminal of the tp differential receiver. 16 rx+ the noninverting terminal of the tp differential receiver. 17 fulld l ttl/cmos duplex mode select. when low, this pin forces the device to operate in fullduplex mode. the input will source less than 175 m a and sink less than 20 m a. 18 pwr v cc power supply pin. with the current consumed at this pin and pin 6, the device will consume less than 180 ma at 5.0 vdc. 19 pwr gnd power ground pin. 20 tx the inverting terminal of the tp differential driver. 21 tx+ the noninverting terminal of the tp differential driver. 22 sqe en l ttl/cmos signal quality error test enable pin. pulling this pin low allows test of the collision detect circuitry without affecting the twisted pair channel. the input will source less than 175 m a and sink less than 20 m a. 23 clk ttl/cmos clock oscillator pin. see pin 24. 24 clk+ ttl/cmos clock oscillator pin. this pin is used with pin 23 if the internal oscillator is to be free run with a crystal. the oscillator can also be directly driven with a ttl/cmos clock signal at this pin. the oscillator frequency should be 10 mhz with a duty cycle of 50 20%.
mc34055 797 motorola analog ic device data functional description introduction the motorola 10baset transceiver, designed to comply with the iso 88023[ieee 802.3] 10baset specification, will support one medium dependent interface (mdi) through standard 10baset filters and transformers. although the device is capable of being used in embedded or external medium attachment units (mau), it was primarily designed for use in repeater or hub applications. for this reason a digital interface is provided rather than an aui interface. this interface is ttl, cmos, and raised ecl compatible and allows for easy connection in hub applications. other features of the mc34055 include: select mode pins of forcing loopback and fullduplex operation; a signal quality error pin for testing the collision detect circuitry without affecting the twisted pair output; and led drivers for link integrity status; collision detection; and jabber detection. an on chip oscillator, capable of receiving a clock input or operating under crystal control, is also provided for internal timing and driving a buffered clock output. data transmission for data intended for the twisted pair, the mc34055 has two data inputs, tx data a and tx data b. tx data a is cmos compatible and tx data b is raised ecl compatible. the inputs were not intended to be used simultaneously in a single application and are internally logically combined. the unused input should be disabled by connection to v cc . when data transmission is intended, the mc34055 detects the first falling edge of the manchester encoded frame at the input being used, synchronizes the on chip oscillator (pins 23 and 24) and asserts the twisted pair driver output to full differential amplitude within 25 ns if the driver enable pin (tx en h) is previously asserted. also, since twisted pair attenuates a 10 mhz signal more than a 5.0 mhz signal the 10baset standard requires that data applied to the twisted pair receive preequalization. to fulfill this requirement the mc34055 provides an additional 730 mv for approximately 50 ns to output data. this is accomplished over the single pair of differential driver pins. tx+ and tx, and effectively equalizes the power of all data components at the receiver. figure 7a shows a 10 mhz waveform. figure 7b shows the effect of preemphasis on a 5.0 mhz waveform. manchester encoded data with the pattern shown in figure 7a would represent a repeating pattern of zeros (000000...). figure 7b would represent an alternating pattern of ones and zeros (0101010...). figure 7a. 10 mhz waveform on differential outputs figure 7b. 5.0 mhz waveform on differential outputs 0 000 00 0 0 1 0 1 bit pattern bit pattern tx+ pin 21 0 v tx+ pin 21 tx pin 20 tx pin 20 0 v 0 v 0 v 50 ns 0.50 ns 0.885 v pp 0.885 v pp 1.25 v pp 1.25 v pp 1.25 v pp 1.25 v pp
mc34055 798 motorola analog ic device data the figures show the voltage waveforms on the differential driver output pins. to actually meet the 10baset specification requires bandpass filtering and a pulse transformer. the output voltage waveform specifications of the ieee 802.3 standard require that voltages impressed on the twisted pair meet a voltage template. the mc34055 can meet the voltage template for all the 10baset applications initiated. in this event, the transmit differential driver will remain active for the entire frame interval and the link pulse will not affect more than one bit interval. the mc34055 also has jabber circuitry to detect and disable the twisted pair driver in the event that a serial controller fails constantly transmitting. should any data source try to transmit longer than 20 ms minimum, the jabber function will disable the differential driver outputs, the figure 8. differential driver media interface circuitry 21 tx z f z o z od /2 tx+ z f r s z od /2 1 +1 pulse transformer twisted pair r s 20 where: z od is the transmitters differential output impedance (~20 w ), where: r s is a 1% series resistor, where: z f is the filters impedance, and z o is the characteristic where: impedance of the twisted pair (100 w ). by choosing the appropriate low pass filter and external components in the driver output circuitry. when the differential transmit driver output pins are configured to drive the bandpass filters and pulse transformer as shown in figure 8, the resultant waveform is capable of meeting the voltage template. following the endofframe activity, an internal pullup resistor pulls tx data a/b high and causes the differential driver to maintain full differential output voltage for approximately 250 ns. the differential driver interprets the lack of transition activity as an end of frame and starts an idle timer. should another frame intended for the twisted pair arrive before the idle timer expires(~250 ns), the idle timer will be reset, if not, the transmit driver function will begin the decay to idle process. during idle periods the differential driver must force the media to a minimal differential voltage unless a link beat is being produced. the transition to minimal voltage is subject to performance requirements in the ieee specification and is met by the mc34055 when the appropriate filters and transformers are used to interface to the media. the mc34055 differential driver generates link pulses (beats) during idle periods. the link pulses produced are singular positive (tx+ positive with respect to tx) pulses applied to the media at 16 ms intervals and last approximately 100 ns. the link pulses allow the receiver at the other end of the link to verify the validity of the segment. there is the possibility, due to the two asynchronous sources, that one of the two input pins (tx data a or tx data b) will receive frame activity immediately after a link pulse is collision presence detector and the internal loopback function. also, two status indicator pins, ctl h and jabb h are asserted. the mc34055 will remain in the jabber state until the tx en h pin is pulled low or the jabbering input ceases to toggle for a minimum of 500 ms. the status indicator pins, ctl h and jabb h will also sink up to 20 ma and can therefore support external leds. the driver also works with the receiver to provide loopback. under normal operating conditions (loop l= a1o), the data applied to the tx data a/b pins is looped back internally to the rx data a/b pins. this function is disabled when there is a collision condition or fulld l is low. data reception data intended for the dte proceeds from the twisted pair to the isolation transformer and bandpass filters before reaching the differential receiver terminals. figure 9 shows the configuration of the external media receive circuitry. once transitions at the receiver terminals (rx+ and rx) are detected, the onchip oscillator is synchronized and the received data is screened by smart squelch circuitry for validity. this qualification requires incoming data to meet amplitude and sequence requirements. if the data meets the smart squelch requirements, the receiver enters the unsquelch state and the data is forwarded to the rx data a/b output pins provided loop l is not low. two data outputs are provided to increase design flexibility, rx data a and rx data b. rx data a is cmos/ttl compatible and rx data b is raised ecl compatible.
mc34055 799 motorola analog ic device data figure 9. differential r eceiver media interface circuitry rx+ z f z o rx z f pulse transformer twisted pair r t 16 15 where: r t is a terminating resistor (100 w ), where: z f is the filters impedance, and z o is the where: characteristic impedance of the twisted pair (100 w ). the mc34055 powers up in a squelched and alink oko state, after which minimum and maximum link test and maximum link fail timers are started. if valid data or a link pulse is received after the link test minimum timer but before the link fail maximum timer times out, the timers are reset and begin counting again. in the event of missing or incorrect link pulses, the mc34055 enters the link fail state whereby the lnkfl h status pin is asserted until valid data or link pulse activity appears at the receiver terminals. powering up in the squelched state assures that the data path to the data output pin (rx data a/b) is disabled, and prevents noise at the receiver terminals (rx+/rx), from being interpreted as valid input data. once transitions appear at the receiver terminals, the smart squelch circuitry checks for the smart squelch requirements to unsquelch; an alternating sequence (1010... or 0101...) of pulses with amplitude of at least 525 mv. this requirement is met by the preamble of an ieee 802.3 frame with good signal to noise ratio. after a pulse is received and checked for proper polarity and amplitude, the pulse width is checked for proper duration. if the duration is to short or too long the smart squelch circuitry resets and begins to look again for a proper sequence. by requiring the differential pulses to meet amplitude and sequence requirements, it is unlikely that pulses due to crosstalk from coresident twisted pairs are capable of causing the receiver to unsquelch. if a positive pulse is received first and the differential driver is not transmitting, the receiver should unsquelch after three alternating pulses. if a negative pulse is received first, one additional pulse is required before unsquelch. if the differential driver is transmitting, three additional pulses are required to unsquelch. after meeting the smart squelch requirements, the mc34055 will pull high the rx en h pin and enable the path to the receive data pin (rx data a/b) provided the mc34055 is not in the loop back test mode (loop l low). if the receiver unsquelches, the receive enable pin remains high and the data path to the receive data pin remains enabled until transitions cease to exist at the receiver terminals. valid data reception is also indicated by high/low transitions of the lnkfl h pin at 100 ms intervals. when transitions at the differential terminals cease, marking the end of frame activity, the receiver reenters the squelch state, pulls low on the rx en h pin, and begins accepting valid link pulses until the start of the next 802.3 frame. if the mc34055 is requested to begin transmitting (tx en h is asserted), and the receiver unsquelches simultaneously, there is a collision. also, if the mc34055 driver enable pin is previously asserted and the receiver detects valid transition activity, the receiver smart squelch circuitry verifies the possibility of collision by requiring three extra transitions at the differential receiver before the unsquelch condition is reached. if unsquelch occurs, a collision condition exists. during all collision conditions the mc34055 asserts the ctl h status pin for the duration of the condition and for a time after the end of collision. during a collision condition the receive and transmit paths are still both enabled allowing transparency to the media. either the presence of simultaneous transmit and receive activity or the condition of the ctl h status pin can be used by the communications controller to acknowledge and react to the collision. in applications where a 10 mhz collision signal is required by an sia, the combination of this status pin and the clock oscillator output can be logically combined to provide a 10 mhz output. if the dte reacts to the collision and ceases transmitting, the mc34055 will decay to idle until a retransmit is attempted. crystal oscillator the mc34055 has an onchip clock oscillator used to provide a reliable and accurate time reference to all the internal timers. the oscillator can be run with a crystal or driven at pin 24 from an external clock source. also provided is a buffered clock output which is useful if the mc34055 is to be used in a repeater or concentrator application. table 1. the crystal used in the oscillator is subject to the following specifications. crystal operating mode fundamental crystal cut type at crystal external shunt capacitance 7.0 pf max crystal resonant mode series crystal accuracy 0.01% @ 25 c crystal temperature variance 0.005% from 0 to 70 c crystal series resistance 25 w max, 17 w typical crystal operating temperature range 0 to 70 c
mc34055 7100 motorola analog ic device data loop l test mode if the loop l pin is low, the mc34055 is in a test mode whereby the data at the input pin (tx data a/b) is being looped back internally to the receive data pin(rx data a/b). in this mode the data path from the differential receiver terminals to the receive data output pins (rx data a/b) is disconnected while the smart squelch functionality of the differential receiver is still operational. this test mode allows the dte to test the mc34055 internal loop back circuitry since the data is looped back to the receive circuitry as close to the twisted pair interface as possible. signal quality error test the mc34055 also provides the ability to test the collision detect circuitry without disabling either of the data paths. by pulling the sqe en l pin low, a collision test is provided to the collision detect circuitry immediately following the last edge of a transmitted 802.3 frame. the test verifies the operability of the collision detect circuitry, operability is announced by the assertion of the ctl h pin for a period following a valid data transmission. jabber detection the transmit circuitry of the mc34055 has the ability to monitor and shut down the differential driver in the event of a jabber condition. if transmission activity ever exceeds 20 ms minimum, the differential driver, the collision detect, and internal loop back circuits are disabled. to announce the presence of a jabber condition, both the ctl h and the jabb h status output pins are asserted. in order to end the jabber condition, the tx data a/b input must stop toggling, or the tx en h pin must be pulled low for a minimum of 500 ms. the status output pins have the ability to drive an external led and were added to facilitize network manageability. the jabber status outputs will not assert during power up or power down. full duplex mode the mc34055 can be operated in a fullduplex mode if required. when the fulld l pin is pulled low the device will enter the full duplex mode. this mode allows the transmitter and driver to operate independently. collision will not be announced and the internal loop back operation is disabled. the signal quality error test, however, is still operational if enabled. status pins the mc34055 has three status indicator pins capable of sourcing or sinking enough current to support an external led. status pin levels (a1o or a0o) report the condition of the transceiver. table 2 shows the combinations and significance. table 2 status pin jabb h ctl h lnkfl h condition a0o a1o x collision condition or signal quality error test. a1o a1o x jabber condition x x a0o link failure. incorrect or nonexistent link pulses, or lack of data at the receiver terminals. x x a1o link aoko. receiving link pulses. x x a0101 o link aoko. receiving valid data. test select pins the mc34055 has three operation mode test select pins, loop l, sqe en l and fulld l. the level of the pin determines the mode of operation. table 3 shows the levels and corresponding conditions of the status pins. table 3 pin status condition loop l a1o normal operating mode. loop back occurs when the transmitter initiates and the receiver is receiving link pulses. the rx en h pin follows the tx en h pin and the transmit data appears on the rx data a/b output pin being used. a0o loop back test mode. the transmit circuit is looped back internally as close to the differential receive circuit as possible. in this mode the rx en h pin follows the tx en h pin and the transmit data ap- pears on the rx data a/b output pin being used. any received data other than link pulses are ignored and the receiver will not unsquelch or announce collision. sqe en l a0o normal operating mode. concurrent transmit and receive activity results in a collision condition. a1o test enabled. an internal test is run on the collision circuitry and the ctl h pin is asserted for a time window following the last positive packet edge. data transmission and reception is undisturbed. fulld l a1o normal operating mode. internal loopback is operable and collision is announced. a0o internal loopback is disabled and collision will not be announced. signal quality error test is still operable.
mc34055 7101 motorola analog ic device data applications information the mc34055 implements the physical layer of a 10baset application of ieee 802.3. it provides the physical connection to the media (twisted pair) and the services required by the mac sublayer of the data link layer. two interfaces are defined in the ieee 802.3 specification of the physical layer; one is the mdi providing connection to the twisted pair; and the other is the aui providing connection to the encoder/decoder function of the data link layer. while the mc34055 provides the connection to the twisted pair, a cmos and raised ecl interface is provided instead of an aui. the mc34055 implements the twisted pair interface of the physical layer in a 802.3 10baset application but circuitry must be added if an aui is desired, (see figure 10 for suggested schematic). for example, an external mau application requires the aui and a twisted pair interface. a chip capable of realizing the aui interface is the texas instruments sn75als085. this ic has an aui interface and another interface which is compatible with the mc34055. the differential input of the 75als085 can be used for the tx+/tx terminals of the aui. the differential drivers of the 75asl085 can be used as the rx+/rx and the col+/col terminals of the aui. the other interface of the 75als085 then will interface to the mc34055 by three paths shown in the application suggestion. the application accounts for all the inputs/outputs of an external mau. embedded applications do not require a full aui and a mc10116 can be used to interface between the raised ecl interfaces of the mc34055 and the aui of existing encoder/decoder chips. the mc10116 is a mecl 10k triple line receiver with typical propagation delay and rise and fall times (20% to 80%) of 2.0 ns. figure 11 shows the use of the mc10116 with the mc34055 and the amd 7992 sia. in a multiport repeater, or hub, a port is required for each dte connected to the ieee 802.3 network. this port consists of two connections, one for the tx+/tx pair and another for the rx+/rx pair. the repeater unit then multiplexes these lines so that all of the stations are capable of transmitting to or receiving from all the other stations on the network. this establishes the need for a transceiver without an aui interface. if an aui is present with each 10baset transceiver, chip count is increased because there is a requirement to convert from balanced to unbalanced lines before multiplexing. an application suggestion for the use of the mc34055 used in a multiport repeater is shown in figure 6. here the receive and transmit lines for the 10baset transceivers are multiplexed by the hub hardware.
mc34055 7102 motorola analog ic device data 75als085 loop1 tx data b tx data a rx data b rx data a tx en h rx en h ctl h jabb h clk tx i2 tx en2 tx en1 tx i1 rx en1 rx o1 loop2 loop l full d sqe en l lnkfl h rx rx+ tx tx+ rx i1 tx o1 tx o1 tx o2 tx o2 rx i1 clk+ dig gnd ana gnd pwr gnd rx i2 rx i2 rx o2 rx en2 gnd gnd gnd gnd mc34055 aui chip clk v cc (dig/ana) v cc pwr v cc v cc out figure 10. external mau application +5.0 +5.0 0.1 0.1 10 10 0.1 1.0 10 10 +5.0 +5.0 4.7 k 4.7 k +5.0 4.7 k +5.0 +5.0 4.7 k nc nc 180 270 820 +5.0 470 470 +5.0 4.7 k balun twisted pair filter filter 39 39 100 10 mhz 20 20 rx tx col aui nc 39.3 39.3 0.1
mc34055 7103 motorola analog ic device data am7990 tx data b tx data a rx data b rx data a tx en h rx en h ctl h jabb h clk loop l full d sqe en l lnkfl h rx rx+ tx tx+ clk+ dig gnd ana gnd pwr gnd mc34055 clk v cc (dig/ana) v cc pwr out rx rx+ tx tx+ coll coll+ tdata tclk tena rclk rdata rena clsn mc10116 am7992 +5.0 0.1 10 1.0 10 figure 11. internal mau application s i a l a n c e balun twisted pair filter filter 39 39 100 4.7 k +5.0 nc nc +5.0 470 470 +5.0 4.7 k 10 mhz 20 20
mc34055 7104 motorola analog ic device data rx rx+ tx tx+ tx en b tx data b rx en b rx data b rx en b rx data b tx en b tx data b 0 0 0 0 7 7 7 7 00000000 hub mc34055 rx rx+ tx tx+ mc34055 hardware figure 12. 10baset connecentrator application balun filter filter balun filter filter aui col tx rx 39.3 39.3 0.1 other mc34055
121 motorola analog ic device data tape and reel options in brief . . . page tape and reel configurations 122 . . . . . . . . . . . . . . . . . . . . . tape and reel information table 124 . . . . . . . . . . . . . . . . . . . analog mpq table 125 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . motorola offers the convenience of tape and reel packaging for our growing family of standard integrated circuit products. reels are available to support the requirements of both first and second generation pickandplace equipment. the packaging fully conforms to the latest eia481a specification. the antistatic embossed tape provides a secure cavity, sealed with a peelback cover tape.
122 motorola analog ic device data tape and reel configurations typical user direction of feed soic and micro8 devices pin 1 typical user direction of feed plcc devices typical user direction of feed dpak and d 2 pak devices mechanical polarization typical user direction of feed sot23 (5 pin) devices typical sot89 (3 pin) devices user direction of feed typical sot89 (5 pin) devices user direction of feed
123 motorola analog ic device data tape and reel configurations (continued) style a (preferred) to92 reel styles carrier strip adhesive tape rounded side feed rounded side of transistor and adhesive tape visible. flat side of transistor and adhesive tape visible. feed adhesive tape on top side carrier strip adhesive tape on top side style m ammo pack is equivalent to style e of reel pack dependent on feed orientation from box. flat side label style m style p (preferred) rounded side style p ammo pack is equivalent to styles a and b of reel pack dependent on feed orientation from box. flat side of transistor and adhesive tape visible. rounded side of transistor and adhesive tape visible. to92 ammo pack styles carrier strip adhesive tape flat side label carrier strip style e feed feed h2a h2a h f1 f2 p2 p2 p1 p d w w1 l1 w2 h2b h2b t1 t t2 h4 h5 h1 l to92 eia radial tape in fan fold box or on reel
124 motorola analog ic device data tape and reel information table tape width devices (1) reel size device package p (mm) per reel (inch) suffix so8, sop8 12 2,500 13 r2 so14 16 2,500 13 r2 so16 16 2,500 13 r2 so16l, so8+8l wide 16 1,000 13 r2 so20l wide 24 1,000 13 r2 so24l wide 24 1,000 13 r2 so28l wide 24 1,000 13 r2 so28l wide 32 1,000 13 r3 micro8 12 2,500 13 r2 plcc20 16 1,000 13 r2 plcc28 24 500 13 r2 plcc44 32 500 13 r2 plcc52 32 500 13 r2 plcc68 44 250 13 r2 plcc84 44 250 13 r2 to226aa (to92) (2) 18 2,000 13 ra, re, rp, or rm (ammo pack) only dpak 16 2,500 13 rk d 2 pak 24 800 13 r4 sot23 (5 pin) 8 3,000 7 tr sot89 (3/5 pin) 12 1,000 7 t1 (1) minimum order quantity is 1 reel. distributors/oem customers may break lots or reels at their option, however broken reels may not be returned. (2) integrated circuits in to226aa packages are available in styes a and e only, with optional aammo packo (suffix rp or rm). the ra and rp configurations are preferred. for ordering information please contact your local motorola semiconductor sales office.
125 motorola analog ic device data analog mpq table tape/reel and ammo pack package type package code mpq package type package code mpq plcc case 775 0802 1000/reel case 776 0804 500/reel case 777 0801 500/reel soic case 751 0095 2500/reel case 751a 0096 2500/reel case 751b 0097 2500/reel case 751g 2003 1000/reel case 751d 2005 1000/reel case 751e 2008 1000/reel case 751f 2009 1000/reel micro8 case 846a 2500/reel to92 case 29 0031 2000/reel case 29 0031 2000/ammo pack dpak case 369a 2500/reel d 2 pak case 936 800/reel sot23 (5 pin) case 1212 3000/reel sot89 (3 pin) case 1213 1000/reel sot89 (5 pin) case 1214 1000/reel
126 motorola analog ic device data
131 motorola analog ic device data packaging information in brief . . . the packaging availability for each device type is indicated on the individual data sheets and the selector guide. all of the outline dimensions for the packages are given in this section. the maximum power consumption an integrated circuit can tolerate at a given operating ambient temperature can be found from the equation: t j(max) t a r q ja(typ) p d(ta) = where: p d(ta) = power dissipation allowable at a given operating ambient temperature. this must be greater than the sum of the products of the supply voltages and supply currents at the worst case operating condition. t j(max) = maximum operating junction temperature as listed in the maximum ratings section. see individual data sheets for t j(max) information. t a = maximum desired operating ambient temperature r q ja(typ) = typical thermal resistance junction-to- ambient
132 motorola analog ic device data case outline dimensions lp, p, z suffix case 29-04 plastic package (to-226aa/to-92) issue ad kc, t suffix case 221a-06 plastic package issue y notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. contour of package beyond dimension r is uncontrolled. 4. dimension f applies between p and l. dimension d and j apply between l and k minimum. lead dimension is uncontrolled in p and beyond dimension k minimum. dim min max min max millimeters inches a 0.175 0.205 4.45 5.20 b 0.170 0.210 4.32 5.33 c 0.125 0.165 3.18 4.19 d 0.016 0.022 0.41 0.55 f 0.016 0.019 0.41 0.48 g 0.045 0.055 1.15 1.39 h 0.095 0.105 2.42 2.66 j 0.015 0.020 0.39 0.50 k 0.500 12.70 l 0.250 6.35 n 0.080 0.105 2.04 2.66 p 0.100 2.54 r 0.115 2.93 v 0.135 3.43 r a p j l f b k g h section xx c v d n n xx seating plane 1 1 2 3 1 2 3 4 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. a k l g d n h q f 123 4 t seating plane s r j u t c 3 pl b y m b m 0.25 (0.010) y dim min max min max millimeters inches a 0.560 0.625 14.23 15.87 b 0.380 0.420 9.66 10.66 c 0.140 0.190 3.56 4.82 d 0.020 0.045 0.51 1.14 f 0.139 0.155 3.53 3.93 g 0.100 bsc 2.54 bsc h 0.280 7.11 j 0.012 0.045 0.31 1.14 k 0.500 0.580 12.70 14.73 l 0.045 0.070 1.15 1.77 n 0.200 bsc 5.08 bsc q 0.100 0.135 2.54 3.42 r 0.080 0.115 2.04 2.92 s 0.020 0.055 0.51 1.39 t 0.235 0.255 5.97 6.47 u 0.000 0.050 0.00 1.27
133 motorola analog ic device data t suffix case 314c01 plastic package issue a th suffix case 314a-03 plastic package issue d t, tv suffix case 314b-05 plastic package issue j 1 5 1 5 1 5 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 0.043 (1.092) maximum. dim a min max min max millimeters 0.572 0.613 14.529 15.570 inches b 0.390 0.415 9.906 10.541 c 0.170 0.180 4.318 4.572 d 0.025 0.038 0.635 0.965 e 0.048 0.055 1.219 1.397 f 0.570 0.585 14.478 14.859 g 0.067 bsc 1.702 bsc j 0.015 0.025 0.381 0.635 k 0.730 0.745 18.542 18.923 l 0.320 0.365 8.128 9.271 q 0.140 0.153 3.556 3.886 s 0.210 0.260 5.334 6.604 u 0.468 0.505 11.888 12.827 t seating plane l s e c f k j optional chamfer 5x d 5x m p m 0.014 (0.356) t g a u b q p notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 10.92 (0.043) maximum. a k b q 5 pl d g j c m q m 0.356 (0.014) t l e t seating plane 12345 dim min max min max millimeters inches a 0.610 0.625 15.59 15.88 b 0.380 0.420 9.65 10.67 c 0.160 0.190 4.06 4.83 d 0.020 0.040 0.51 1.02 e 0.035 0.055 0.89 1.40 g 0.067 bsc 1.702 bsc j 0.015 0.025 0.38 0.64 k 0.500 12.70 l 0.355 0.370 9.02 9.40 q 0.139 0.147 3.53 3.73 v q k f u a b g p m 0.10 (0.254) p m t 5x j m 0.24 (0.610) t optional chamfer s l w e c h n t seating plane notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 0.043 (1.092) maximum. dim min max min max millimeters inches a 0.572 0.613 14.529 15.570 b 0.390 0.415 9.906 10.541 c 0.170 0.180 4.318 4.572 d 0.025 0.038 0.635 0.965 e 0.048 0.055 1.219 1.397 f 0.850 0.935 21.590 23.749 g 0.067 bsc 1.702 bsc h 0.166 bsc 4.216 bsc j 0.015 0.025 0.381 0.635 k 0.900 1.100 22.860 27.940 l 0.320 0.365 8.128 9.271 n 0.320 bsc 8.128 bsc q 0.140 0.153 3.556 3.886 s 0.620 15.748 u 0.468 0.505 11.888 12.827 v 0.735 18.669 w 0.090 0.110 2.286 2.794 5x d
134 motorola analog ic device data dt-1 suffix case 369-07 plastic package (dpak) issue k t, t1 suffix case 314d-03 plastic package issue d 2 3 4 1 2 3 1 4 5 dt suffix case 369a-13 plastic package (dpak) issue y 4 3 1 d a k b r v s f l g 2 pl m 0.13 (0.005) t e c u j h t seating plane z dim min max min max millimeters inches a 0.235 0.250 5.97 6.35 b 0.250 0.265 6.35 6.73 c 0.086 0.094 2.19 2.38 d 0.027 0.035 0.69 0.88 e 0.033 0.040 0.84 1.01 f 0.037 0.047 0.94 1.19 g 0.180 bsc 4.58 bsc h 0.034 0.040 0.87 1.01 j 0.018 0.023 0.46 0.58 k 0.102 0.114 2.60 2.89 l 0.090 bsc 2.29 bsc r 0.175 0.215 4.45 5.46 s 0.020 0.050 0.51 1.27 u 0.020 0.51 v 0.030 0.050 0.77 1.27 z 0.138 3.51 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 123 4 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 123 4 v s a k t seating plane r b f g d 3 pl m 0.13 (0.005) t c e j h dim min max min max millimeters inches a 0.235 0.250 5.97 6.35 b 0.250 0.265 6.35 6.73 c 0.086 0.094 2.19 2.38 d 0.027 0.035 0.69 0.88 e 0.033 0.040 0.84 1.01 f 0.037 0.047 0.94 1.19 g 0.090 bsc 2.29 bsc h 0.034 0.040 0.87 1.01 j 0.018 0.023 0.46 0.58 k 0.350 0.380 8.89 9.65 r 0.175 0.215 4.45 5.46 s 0.050 0.090 1.27 2.28 v 0.030 0.050 0.77 1.27 q 12345 u k d g s a b 5 pl j h l e c m q m 0.356 (0.014) t seating plane t dim min max min max millimeters inches a 0.572 0.613 14.529 15.570 b 0.390 0.415 9.906 10.541 c 0.170 0.180 4.318 4.572 d 0.025 0.038 0.635 0.965 e 0.048 0.055 1.219 1.397 g 0.067 bsc 1.702 bsc h 0.087 0.112 2.210 2.845 j 0.015 0.025 0.381 0.635 k 1.020 1.065 25.908 27.051 l 0.320 0.365 8.128 9.271 q 0.140 0.153 3.556 3.886 u 0.105 0.117 2.667 2.972 s 0.543 0.582 13.792 14.783 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension d does not include interconnect bar (dambar) protrusion. dimension d including protrusion shall not exceed 10.92 (0.043) maximum.
135 motorola analog ic device data dp1, n, p, p1 suffix case 626-05 plastic package issue k n, p, n-14, p2 suffix case 646-06 plastic package issue l 14 1 dp2, n, p, pc suffix case 648-08 plastic package issue r 16 1 8 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. rounded corners optional. a b f c s h g d j l m 16 pl seating 18 9 16 k plane t m a m 0.25 (0.010) t dim min max min max millimeters inches a 0.740 0.770 18.80 19.55 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.040 0.70 1.02 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.110 0.130 2.80 3.30 l 0.295 0.305 7.50 7.74 m 0 10 0 10 s 0.020 0.040 0.51 1.01 notes: 1. leads within 0.13 (0.005) radius of true position at seating plane at maximum material condition. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 4. rounded corners optional. 17 14 8 b a f hg d k c n l j m seating plane dim min max min max millimeters inches a 0.715 0.770 18.16 19.56 b 0.240 0.260 6.10 6.60 c 0.145 0.185 3.69 4.69 d 0.015 0.021 0.38 0.53 f 0.040 0.070 1.02 1.78 g 0.100 bsc 2.54 bsc h 0.052 0.095 1.32 2.41 j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.300 bsc 7.62 bsc m 0 10 0 10 n 0.015 0.039 0.39 1.01 notes: 1. dimension l to center of lead when formed parallel. 2. package contour optional (round or square corners). 3. dimensioning and tolerancing per ansi y14.5m, 1982. 14 5 8 f note 2 a b t seating plane h j g d k n c l m m a m 0.13 (0.005) b m t dim min max min max inches millimeters a 9.40 10.16 0.370 0.400 b 6.10 6.60 0.240 0.260 c 3.94 4.45 0.155 0.175 d 0.38 0.51 0.015 0.020 f 1.02 1.78 0.040 0.070 g 2.54 bsc 0.100 bsc h 0.76 1.27 0.030 0.050 j 0.20 0.30 0.008 0.012 k 2.92 3.43 0.115 0.135 l 7.62 bsc 0.300 bsc m 10 10 n 0.76 1.01 0.030 0.040
136 motorola analog ic device data b, p, p2, v suffix case 648c-03 plastic package (dip16) issue c 16 1 p suffix case 648e01 plastic package (dip16) issue o p suffix case 649-03 plastic package issue d 24 1 notes: 1. leads within 0.13 (0.005) radius of true position at seating plane at maximum material condition. 2. dimension l to center of leads when formed parallel. seating plane 1 12 24 13 j g f c k b h n q p a d m l dim min max min max inches millimeters a 31.50 32.13 1.240 1.265 b 13.21 13.72 0.520 0.540 c 4.70 5.21 0.185 0.205 d 0.38 0.51 0.015 0.020 f 1.02 1.52 0.040 0.060 g 2.54 bsc 0.100 bsc h 1.65 2.16 0.065 0.085 j 0.20 0.30 0.008 0.012 k 2.92 3.43 0.115 0.135 l 14.99 15.49 0.590 0.610 m 10 10 n 0.51 1.02 0.020 0.040 p 0.13 0.38 0.005 0.015 q 0.51 0.76 0.020 0.030 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension a and b does not include mold protrusion. 5. mold flash or protrusions shall not exceed 0.25 (0.010). 6. rounded corner optional. a b 16 9 18 d g h s c 13 pl s b m 0.25 (0.010) t t seating plane j m l r p f k s a dim min max min max millimeters inches a 0.740 0.760 18.80 19.30 b 0.245 0.260 6.23 6.60 c 0.145 0.175 3.69 4.44 d 0.015 0.021 0.39 0.53 f 0.050 0.070 1.27 1.77 g 0.100 bsc 2.54 bsc h 0.050 bsc 1.27 bsc j 0.008 0.015 0.21 0.38 k 0.120 0.140 3.05 3.55 l 0.295 0.305 7.50 7.74 m 0 10 0 10 p 0.200 bsc 5.08 bsc r 0.300 bsc 7.62 bsc s 0.015 0.035 0.39 0.88 dim min max min max millimeters inches a 0.740 0.840 18.80 21.34 b 0.240 0.260 6.10 6.60 c 0.145 0.185 3.69 4.69 d 0.015 0.021 0.38 0.53 e 0.050 bsc 1.27 bsc f 0.040 0.70 1.02 1.78 g 0.100 bsc 2.54 bsc j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.300 bsc 7.62 bsc m 0 10 0 10 n 0.015 0.040 0.39 1.01 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of leads when formed parallel. 4. dimension b does not include mold flash. 5. internal lead connection between 4 and 5, 12 and 13. a b 16 9 18 f d g e n k c note 5 16 pl s a m 0.13 (0.005) t t seating plane s b m 0.13 (0.005) t j 16 pl m l 1 16
137 motorola analog ic device data a, b, n, p suffix case 707-02 plastic package issue c 18 1 p suffix case 710-02 plastic package issue b 28 1 notes: 1. positional tolerance of leads (d), shall be within 0.25 (0.010) at maximum material condition, in relation to seating plane and each other. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 1 seating plane 15 14 28 m a b k c n f g d h j l dim min max min max inches millimeters a 36.45 37.21 1.435 1.465 b 13.72 14.22 0.540 0.560 c 3.94 5.08 0.155 0.200 d 0.36 0.56 0.014 0.022 f 1.02 1.52 0.040 0.060 g 2.54 bsc 0.100 bsc h 1.65 2.16 0.065 0.085 j 0.20 0.38 0.008 0.015 k 2.92 3.43 0.115 0.135 l 15.24 bsc 0.600 bsc m 0 15 0 15 n 0.51 1.02 0.020 0.040 notes: 1. positional tolerance of leads (d), shall be within 0.25 (0.010) at maximum material condition, in relation to seating plane and each other. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 1 seating plane 10 9 18 m a b k c n f g d h j l dim min max min max inches millimeters a 22.22 23.24 0.875 0.915 b 6.10 6.60 0.240 0.260 c 3.56 4.57 0.140 0.180 d 0.36 0.56 0.014 0.022 f 1.27 1.78 0.050 0.070 g 2.54 bsc 0.100 bsc h 1.02 1.52 0.040 0.060 j 0.20 0.30 0.008 0.012 k 2.92 3.43 0.115 0.135 l 7.62 bsc 0.300 bsc m 0 15 0 15 n 0.51 1.02 0.020 0.040 p suffix case 711-03 plastic package issue c 40 1 notes: 1. positional tolerance of leads (d), shall be within 0.25 (0.010) at maximum material condition, in relation to seating plane and each other. 2. dimension l to center of leads when formed parallel. 3. dimension b does not include mold flash. 120 40 21 b a c seating plane d f g h k n m j l dim min max min max inches millimeters a 51.69 52.45 2.035 2.065 b 13.72 14.22 0.540 0.560 c 3.94 5.08 0.155 0.200 d 0.36 0.56 0.014 0.022 f 1.02 1.52 0.040 0.060 g 2.54 bsc 0.100 bsc h 1.65 2.16 0.065 0.085 j 0.20 0.38 0.008 0.015 k 2.92 3.43 0.115 0.135 l 15.24 bsc 0.600 bsc m 0 15 0 15 n 0.51 1.02 0.020 0.040
138 motorola analog ic device data d, d1, d2 suffix case 751-05 plastic package (so-8, sop-8) issue r h, p, dp suffix case 738-03 plastic package issue e f, p, p-3 suffix case 724-03 plastic package (ndip24) issue d 24 1 notes: 1. chamfered contour optional. 2. dimension l to center of leads when formed parallel. 3. dimensioning and tolerancing per ansi y14.5m, 1982. 4. controlling dimension: inch. a b 24 13 12 1 t seating plane 24 pl k e f n c d g m a m 0.25 (0.010) t 24 pl j m b m 0.25 (0.010) t l m note 1 dim min max min max millimeters inches a 1.230 1.265 31.25 32.13 b 0.250 0.270 6.35 6.85 c 0.145 0.175 3.69 4.44 d 0.015 0.020 0.38 0.51 e 0.050 bsc 1.27 bsc f 0.040 0.060 1.02 1.52 g 0.100 bsc 2.54 bsc j 0.007 0.012 0.18 0.30 k 0.110 0.140 2.80 3.55 l 0.300 bsc 7.62 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.01 20 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimension b does not include mold flash. m l j 20 pl m b m 0.25 (0.010) t dim min max min max millimeters inches a 25.66 27.17 1.010 1.070 b 6.10 6.60 0.240 0.260 c 3.81 4.57 0.150 0.180 d 0.39 0.55 0.015 0.022 g 2.54 bsc 0.100 bsc j 0.21 0.38 0.008 0.015 k 2.80 3.55 0.110 0.140 l 7.62 bsc 0.300 bsc m 0 15 0 15 n 0.51 1.01 0.020 0.040 e 1.27 1.77 0.050 0.070 1 11 10 20 a seating plane k n f g d 20 pl t m a m 0.25 (0.010) t e b c f 1.27 bsc 0.050 bsc 8 1 seating plane 1 4 5 8 a 0.25 m cb ss 0.25 m b m h c x 45 l dim min max millimeters a 1.35 1.75 a1 0.10 0.25 b 0.35 0.49 c 0.18 0.25 d 4.80 5.00 e 1.27 bsc e 3.80 4.00 h 5.80 6.20 h 0 7 l 0.40 1.25 0.25 0.50 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. dimensions are in millimeters. 3. dimension d and e do not include mold protrusion. 4. maximum mold protrusion 0.15 per side. 5. dimension b does not include mold protrusion. allowable dambar protrusion shall be 0.127 total in excess of the b dimension at maximum material condition. d e h a b e b a1 c a 0.10
139 motorola analog ic device data d suffix case 751a-03 plastic package (so-14) issue f 14 1 d suffix case 751b-05 plastic package (so-16) issue j 16 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. a b g p 7 pl 14 8 7 1 m 0.25 (0.010) b m s b m 0.25 (0.010) a s t t f r x 45 seating plane d 14 pl k c j m dim min max min max inches millimeters a 8.55 8.75 0.337 0.344 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.228 0.244 r 0.25 0.50 0.010 0.019 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. 18 16 9 seating plane f j m r x 45 g 8 pl p b a m 0.25 (0.010) b s t d k c 16 pl s b m 0.25 (0.010) a s t dim min max min max inches millimeters a 9.80 10.00 0.386 0.393 b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019 dw, fp suffix case 751d-04 plastic package (so-20l, so20) issue e 20 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.150 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b 20 1 11 10 s a m 0.010 (0.25) b s t d 20x m b m 0.010 (0.25) p 10x j f g 18x k c t seating plane m r x 45 dim min max min max inches millimeters a 12.65 12.95 0.499 0.510 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.50 0.90 0.020 0.035 g 1.27 bsc 0.050 bsc j 0.25 0.32 0.010 0.012 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029
1310 motorola analog ic device data dw suffix case 751e-04 plastic package (so-24l, sop (16+4+4)l) issue e 24 1 dw suffix case 751f-04 plastic package (so-28l, soic28) issue e 28 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b p 12x d 24x 12 13 24 1 m 0.010 (0.25) b m s a m 0.010 (0.25) b s t t g 22x seating plane k c r x 45 m f j dim min max min max inches millimeters a 15.25 15.54 0.601 0.612 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.41 0.90 0.016 0.035 g 1.27 bsc 0.050 bsc j 0.23 0.32 0.009 0.013 k 0.13 0.29 0.005 0.011 m 0 8 0 8 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. j k f 1 15 14 28 a b 28x 14x d p s a m 0.010 (0.25) b s t m 0.010 (0.25) b m 26x g t seating plane c x 45 r m dim min max min max inches millimeters a 17.80 18.05 0.701 0.711 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.41 0.90 0.016 0.035 g 1.27 bsc 0.050 bsc j 0.23 0.32 0.009 0.013 k 0.13 0.29 0.005 0.011 m 0 8 0 8 p 10.01 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 dw suffix case 751g-02 plastic package (so-16l, sop16l, sop-8+8l) issue a 16 1 dim min max min max inches millimeters a 10.15 10.45 0.400 0.411 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.50 0.90 0.020 0.035 g 1.27 bsc 0.050 bsc j 0.25 0.32 0.010 0.012 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 m b m 0.010 (0.25) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b p 8x g 14x d 16x seating plane t s a m 0.010 (0.25) b s t 16 9 8 1 f j r x 45 m c k
1311 motorola analog ic device data d suffix case 751k01 plastic package (so16) issue o 16 1 dw suffix case 751n01 plastic package (sop16l) issue o notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimensions a and b do not include mold protrusion. 4 maximum mold protrusion 0.15 (0.006) per side. 5 dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.127 (0.005) total in excess of the d dimension at maximum material condition. dim a min max min max inches 9.80 10.00 0.368 0.393 millimeters b 3.80 4.00 0.150 0.157 c 1.35 1.75 0.054 0.068 d 0.35 0.49 0.014 0.019 f 0.40 1.25 0.016 0.049 g 1.27 bsc 0.050 bsc j 0.19 0.25 0.008 0.009 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 5.80 6.20 0.229 0.244 r 0.25 0.50 0.010 0.019 18 9 16 g p c k 14 x d seating plane j r m a b m 0.25 (0.010) b s f x 45 t s a m 0.25 (0.010) b s t 16 1 dim min max min max inches millimeters a 10.15 10.45 0.400 0.411 b 7.40 7.60 0.292 0.299 c 2.35 2.65 0.093 0.104 d 0.35 0.49 0.014 0.019 f 0.50 0.90 0.020 0.035 g 1.27 bsc 0.050 bsc j 0.25 0.32 0.010 0.012 k 0.10 0.25 0.004 0.009 m 0 7 0 7 p 10.05 10.55 0.395 0.415 r 0.25 0.75 0.010 0.029 m b m 0.010 (0.25) notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimensions a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006) per side. 5. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.005) total in excess of d dimension at maximum material condition. a b p g 9x d 13x seating plane t s a m 0.010 (0.25) b s t 16 9 8 1 f j r x 45 m t s s 2.54 bsc 0.100 bsc t 3.81 bsc 0.150 bsc c k
1312 motorola analog ic device data case 762-01 plastic medium power package (sip-9) issue c 1 9 fn suffix case 775-02 plastic package (plcc-20) issue c 1 notes: 1. dimensioning and tolerancing per ansi y14.5, 1982. 2. controlling dimension: millimeter. 1 seating plane 9 u m a m 0.25 (0.010) t m a m 0.25 (0.010) t m c m 0.25 (0.010) t d 9 pl c a t e b k n m v s y r g f w q x j h dim min max min max inches millimeters a 22.40 23.00 0.873 0.897 b 6.40 6.60 0.252 0.260 c 3.45 3.65 0.135 1.143 d 0.40 0.55 0.015 0.021 e 9.35 9.60 0.368 0.377 f 1.40 1.60 0.055 0.062 g 2.54 bsc 0.100 bsc h 1.51 1.71 0.059 0.067 j 0.360 0.400 0.014 0.015 k 3.95 4.20 0.155 0.165 m 30 bsc 30 bsc n 2.50 2.70 0.099 0.106 q 3.15 3.45 0.124 0.135 r 13.60 13.90 0.535 0.547 s 1.65 1.95 0.064 0.076 u 22.00 22.20 0.866 0.874 v 0.55 0.75 0.021 0.029 w 2.89 bsc 0.113 bsc x 0.65 0.75 0.025 0.029 y 2.70 2.80 0.106 0.110 notes: 1. datums l, m, and n determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum t, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.250) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). m n l y brk w v d d s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t s lm s 0.010 (0.250) n s t x g1 b u z view dd 20 1 s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t s lm s 0.010 (0.250) n s t c g view s e j r z a 0.004 (0.100) t seating plane s lm m 0.007 (0.180) n s t s lm m 0.007 (0.180) n s t h view s k k1 f g1 dim min max min max millimeters inches a 0.385 0.395 9.78 10.03 b 0.385 0.395 9.78 10.03 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 0.51 k 0.025 0.64 r 0.350 0.356 8.89 9.04 u 0.350 0.356 8.89 9.04 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y 0.020 0.50 z 2 10 2 10 g1 0.310 0.330 7.88 8.38 k1 0.040 1.02
1313 motorola analog ic device data fn suffix case 776-02 plastic package (plcc28) issue d 1 notes: 1. datums l, m, and n determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum t, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.250) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). n m l v w d d y brk 28 1 view s s lm s 0.010 (0.250) n s t s lm m 0.007 (0.180) n s t 0.004 (0.100) g1 g j c z r e a seating plane s lm m 0.007 (0.180) n s t t b s lm s 0.010 (0.250) n s t s lm m 0.007 (0.180) n s t u s lm m 0.007 (0.180) n s t z g1 x view dd s lm m 0.007 (0.180) n s t k1 view s h k f s lm m 0.007 (0.180) n s t dim min max min max millimeters inches a 0.485 0.495 12.32 12.57 b 0.485 0.495 12.32 12.57 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 0.51 k 0.025 0.64 r 0.450 0.456 11.43 11.58 u 0.450 0.456 11.43 11.58 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y 0.020 0.50 z 2 10 2 10 g1 0.410 0.430 10.42 10.92 k1 0.040 1.02
1314 motorola analog ic device data fn suffix case 777-02 plastic package (plcc) issue c m suffix case 803c preliminary plastic package 1 1 20 n l m d y d k v w 1 44 brk b z u x view dd s lm m 0.007(0.180) n s t s lm m 0.007(0.180) n s t g1 s lm s 0.010 (0.25) n s t k1 f h s lm m 0.007(0.180) n s t z g g1 r a e j view s c s lm m 0.007(0.180) n s t s lm m 0.007(0.180) n s t 0.004 (0.10) t seating plane view s s lm s 0.010 (0.25) n s t s lm m 0.007(0.180) n s t notes: 1. datums l, m, and n are determined where top of lead shoulder exits plastic body at mold parting line. 2. dimension g1, true position to be measured at datum t, seating plane. 3. dimensions r and u do not include mold flash. allowable mold flash is 0.010 (0.25) per side. 4. dimensioning and tolerancing per ansi y14.5m, 1982. 5. controlling dimension: inch. dim min max min max millimeters inches a 0.685 0.695 17.40 17.65 b 0.685 0.695 17.40 17.65 c 0.165 0.180 4.20 4.57 e 0.090 0.110 2.29 2.79 f 0.013 0.019 0.33 0.48 g 0.050 bsc 1.27 bsc h 0.026 0.032 0.66 0.81 j 0.020 0.51 k 0.025 0.64 r 0.650 0.656 16.51 16.66 u 0.650 0.656 16.51 16.66 v 0.042 0.048 1.07 1.21 w 0.042 0.048 1.07 1.21 x 0.042 0.056 1.07 1.42 y 0.020 0.50 z 2 10 2 10 g1 0.610 0.630 15.50 16.00 k1 0.040 1.02 6. the package top may be smaller than the package bottom by up to 0.012 (0.300). dimensions r and u are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 7. dimension h does not include dambar protrusion or intrusion. the dambar protrusion(s) shall not cause the h dimension to be greater than 0.037 (0.940). the dambar intrusion(s) shall not cause the h dimension to be smaller than 0.025 (0.635). dim a min max min max inches 12.35 12.80 0.486 0.504 millimeters b 5.10 5.45 0.201 0.215 c 1.95 2.05 0.077 0.081 d 0.35 0.50 0.014 0.020 e 0.81 0.032 f 12.40* 0.488* g 1.15 1.39 0.045 0.055 h 0.59 0.81 0.023 0.032 j 0.18 0.27 0.007 0.011 k 1.10 1.50 0.043 0.059 l 0.05 0.20 0.001 0.008 m 0 10 n 0.50 0.85 0.020 0.033 s 7.40 8.20 0.291 0.323 0 10 notes: 6 dimensioning and tolerancing per ansi y14.5m, 1982. 7 controlling dimension: millimeter. 8 dimensions a and b do not include mold protrusion. 9 maximum mold protrusion 0.15 (0.008) per side. 10 dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.13 (0.006) total in excess of the d dimension at maximum material condition. *approximate a 0.13 (0.005) m tb ss 0.13 (0.005) m b m s 10 pl g d 20 pl l c 0.10 (0.004) seating plane k n j m e 1 20 11 10 a f b t
1315 motorola analog ic device data tv suffix case 821c-04 plastic package (15-pin zip) issue d 1 15 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension r does not include mold flash or protrusions. 4. dimension b does not include mold flash or protrusions. 5. mold flash or protrusions shall not exceed 0.010 (0.250). 6. dimension d does not include dambar protrusion. allowable protrusion shall be 0.003 (0.076) total in excess of the d dimension. at maximum material condition. dim min max min max millimeters inches a 0.684 0.694 17.374 17.627 b 0.784 0.792 19.914 20.116 c 0.173 0.181 4.395 4.597 d 0.024 0.031 0.610 0.787 e 0.058 0.062 1.473 1.574 g 0.050 bsc 1.270 bsc h 0.169 bsc 4.293 bsc j 0.018 0.024 0.458 0.609 k 0.700 0.710 17.780 18.034 l 0.200 bsc 5.080 bsc m 0.148 0.151 3.760 3.835 r 0.416 0.426 10.567 10.820 s 0.157 0.167 3.988 4.242 u 0.105 0.115 2.667 2.921 v 0.868 ref 22.047 ref y 0.625 0.639 15.875 16.231 b d u pin 15 15x g r a pin 1 m q p p m 0.010 (0.254) q s t j 15x m 0.024 (0.610) t k l h s v e c y t seating plane t suffix case 821d-03 plastic package issue c notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension r does not include mold flash or protrusions. 4. dimension b does not include mold flash or protrusions. 5. mold flash or protrusions shall not exceed 0.010 (0.250). 6. deleted 7. dimension d does not include dambar protrusion. allowable protrusion shall be 0.003 (0.076) total in excess of the d dimension. at maximum material condition. dim min max min max millimeters inches a 0.681 0.694 17.298 17.627 b 0.784 0.792 19.914 20.116 c 0.173 0.181 4.395 4.597 d 0.024 0.031 0.610 0.787 e 0.058 0.062 1.473 1.574 f g 0.050 bsc 1.270 bsc h 0.110 bsc 0.407 0.584 j 0.018 0.024 0.458 0.609 k q 0.148 0.151 3.760 3.835 r 0.416 0.426 10.567 10.820 u 0.110 bsc 2.794 bsc y 0.503 ref 12.776 ref b d u pin 15 15x g r a pin 1 q l p p m 0.010 (0.254) l s t j 15x m 0.024 (0.610) t k h e c y t seating plane f 7x 0.016 0.023 1.078 1.086 2.794 bsc 27.382 27.584 1 15
1316 motorola analog ic device data ftb suffix case 824d01 plastic package (tqfp44) issue o 1 ???? ???? notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u and z to be determined at datum plane ab. 5. dimensions s and v to be determined at seating plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.530 (0.021). 44 1 34 33 11 12 22 23 detail aa z t a s tu m 0.20 (0.008) z s ab 0.05 (0.002) tu s b v u m y e h c ab detail ad 0.10 (0.004) k w x view ad t, u, z f n section aeae j d base metal plating ae ae g 0.05 (0.002) z detail aa dim min max min max inches millimeters a 9.950 10.050 0.392 0.396 b 9.950 10.050 0.392 0.396 c 1.400 1.600 0.055 0.063 d 0.300 0.450 0.012 0.018 e 1.350 1.450 0.053 0.057 f 0.300 0.400 0.012 0.016 g 0.800 bsc 0.031 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.450 0.550 0.018 0.022 l 8.000 bsc 0.315 bsc m 12 ref 12 ref n 0.090 0.160 0.004 0.006 q 1 5 1 5 r 0.100 0.200 0.004 0.008 s 11.900 12.100 0.469 0.476 v 11.900 12.100 0.469 0.476 w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref y 12 ref 12 ref l l s tu m 0.20 (0.008) z s ac s tu m 0.20 (0.008) z s ab s tu m 0.20 (0.008) z s ac ac q s tu m 0.20 (0.008) z s ac r
1317 motorola analog ic device data fb suffix case 824e02 plastic package (qfp) issue a ??? ??? 44 1 34 33 11 12 22 23 view y n l a s lm m 0.20 (0.008) n s h s lm m 0.20 (0.008) n s t 0.05 (0.002) lm s b v m t m y e w c h datum plane view p 0.01 (0.004) h datum plane r2 k a1 c1 view p dim min max min max inches millimeters a 9.90 10.10 0.390 0.398 b 9.90 10.10 0.390 0.398 c 2.00 2.21 0.079 0.087 d 0.30 0.45 0.0118 0.0177 e 2.00 2.10 0.079 0.083 f 0.30 0.40 0.012 0.016 g 0.80 bsc 0.031 bsc j 0.13 0.23 0.005 0.009 k 0.65 0.95 0.026 0.037 m 5 10 5 10 s 12.95 13.45 0.510 0.530 v 12.95 13.45 0.510 0.530 w 0.000 0.210 0.000 0.008 y 5 10 5 10 a1 0.450 ref 0.170 0.018 ref 0.007 b1 l, m, n s lm m 0.20 (0.008) n s t f b1 section j1j1 j d base metal g 40x r r1 r 1 2 plating 44 pl j1 j1 g c1 1.600 ref 0.063 ref r1 r2 5 10 5 10 1 2 0.130 0.005 0.130 0.300 0.005 0.012 0.130 0.300 0.005 0.012 0 7 0 7 pin 1 ident s lm m 0.20 (0.008) n s h 0.05 (0.002) n s lm m 0.20 (0.008) n s t view y 3 pl notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums l, m and n to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane t. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane h. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.530 (0.021). 1 44
1318 motorola analog ic device data fb suffix case 840f01 plastic package issue o ?? ?? ?? ?? 0.20 (0.008) ac m z tu s s 0.20 (0.008) ab m z tu s s 0.20 (0.008) ac m z tu s s 0.20 (0.008) ab m z tu s s 0.20 (0.008) ac m z tu s s z 0.050 (0.002) 0.050 (0.002) tu z u t l detail aa l 1 64 49 48 16 33 17 32 a s b v 0.10 (0.004) ab e h c y m detail ad ac r detail ad w k x q j d n base section aeae f metal detail aa g ae ae p t, u, z notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u and z to be determined at datum plane ac. 5. dimensions s and v to be determined at seating plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010 ) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). dim a min max min max inches 9.950 10.050 0.392 0.396 millimeters b 9.950 10.050 0.392 0.396 c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.500 bsc 0.020 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.450 0.550 0.018 0.022 l m n 0.090 0.160 0.004 0.006 p q 1 5 r 0.100 0.200 0.004 0.008 s 11.900 12.100 0.469 0.476 v 11.900 12.100 0.469 0.476 w x y 1.000 ref 12 ref 0.200 ref 0.039 ref 0.008 ref 0.010 bsc 0.250 bsc 7.500 bsc 0.295 bsc 5 12 ref 5 12 ref 5 12 ref 5 5 1 5 5 5 5 1 64
1319 motorola analog ic device data dm suffix case 846a02 plastic package (micro8) issue c 1 s b m 0.08 (0.003) a s t dim min max min max inches millimeters a 2.90 3.10 0.114 0.122 b 2.90 3.10 0.114 0.122 c 1.10 0.043 d 0.25 0.40 0.010 0.016 g 0.65 bsc 0.026 bsc h 0.05 0.15 0.002 0.006 j 0.13 0.23 0.005 0.009 k 4.75 5.05 0.187 0.199 l 0.40 0.70 0.016 0.028 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. b a d k g pin 1 id 8 pl 0.038 (0.0015) t seating plane c h j l 8
1320 motorola analog ic device data fb suffix case 848b-04 plastic package (tqfp52) issue c 1 52 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums a, b and d to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane c. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane h. 7. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the d dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. detail a l 39 40 26 27 1 52 14 13 l a b v s ab m 0.20 (0.008) d s h ab 0.05 (0.002) s ab m 0.20 (0.008) d s c d b v b s ab m 0.20 (0.008) d s h ab 0.05 (0.002) s ab m 0.20 (0.008) d s c h 0.10 (0.004) c seating plane datum plane m g h e c m detail c u q x w k t r detail c dim min max min max inches millimeters a 9.90 10.10 0.390 0.398 b 9.90 10.10 0.390 0.398 c 2.10 2.45 0.083 0.096 d 0.22 0.38 0.009 0.015 e 2.00 2.10 0.079 0.083 f 0.22 0.33 0.009 0.013 g 0.65 bsc 0.026 bsc h 0.25 0.010 j 0.13 0.23 0.005 0.009 k 0.65 0.95 0.026 0.037 l 7.80 ref 0.307 ref m 5 10 5 10 n 0.13 0.17 0.005 0.007 q 0 7 0 7 r 0.13 0.30 0.005 0.012 s 12.95 13.45 0.510 0.530 t 0.13 0.005 u 0 0 v 12.95 13.45 0.510 0.530 w 0.35 0.45 0.014 0.018 x 1.6 ref 0.063 ref b b detail a a, b, d jn d f base metal section bb s ab m 0.02 (0.008) d s c
1321 motorola analog ic device data fb suffix case 848d03 plastic package issue c f notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums l, m and n to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane t. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane -h-. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the lead width to exceed 0.46 (0.018). minimum space between protrusion and adjacent lead or protrusion 0.07 (0.003). ??? ??? view aa view aa 2 x r r1 ab ab view y section abab rotated 90 clockwise dim a min max min max inches 10.00 bsc 0.394 bsc millimeters a1 5.00 bsc 0.197 bsc b 10.00 bsc 0.394 bsc b1 5.00 bsc 0.197 bsc c 1.70 0.067 c1 0.05 0.20 0.002 0.008 c2 1.30 1.50 0.051 0.059 d 0.20 0.40 0.008 0.016 e 0.45 0.030 f 0.22 0.35 0.009 0.014 g 0.65 bsc 0.75 0.018 0.026 bsc j 0.07 0.20 0.003 0.008 k 0.50 ref 0.020 ref r1 0.08 0.20 0.003 0.008 s 12.00 bsc 0.472 bsc s1 6.00 bsc 0.236 bsc u 0.09 0.16 0.004 0.006 v 12.00 bsc 0.472 bsc v1 6.00 bsc 0.236 bsc w 0.20 ref 0.008 ref z 1.00 ref 0.039 ref c l x x=l, m, n 1 13 14 26 27 39 40 52 4x tips 4x n 0.20 (0.008) h lm n 0.20 (0.008) t lm 3x view y seating plane c 0.10 (0.004) t 4x q 3 4x q 2 s 0.05 (0.002) 0.25 (0.010) gage plane c2 c1 w k e z s lm m 0.13 (0.005) n s t plating base metal d j u b v b1 a s v1 a1 s1 l n m h t q 1 q g q 1 q q 3 q 2 07 12 513 07 0 0 ref 12 ref 13 5 52 1
1322 motorola analog ic device data b suffix case 85901 plastic package (sdip) issue o 56 1 a b t 56 29 128 seating plane j 56 pl d 56 pl s a m 0.25 (0.010) t n f g e s b m 0.25 (0.010) t k c h l m dim min max min max millimeters inches a 2.035 2.065 51.69 52.45 b 0.540 0.560 13.72 14.22 c 0.155 0.200 3.94 5.08 d 0.014 0.022 0.36 0.56 e 0.035 bsc 0.89 bsc f 0.032 0.046 0.81 1.17 g 0.070 bsc 1.778 bsc h 0.300 bsc 7.62 bsc j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.600 bsc 15.24 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.02 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimensions a and b do not include mold flash. maximum mold flash 0.25 (0.010) b suffix case 85801 plastic package issue o a 121 42 22 b seating plane t s a m 0.25 (0.010) t s b m 0.25 (0.010) t l h m j 42 pl d 42 pl f g n k c notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension l to center of lead when formed parallel. 4. dimensions a and b do not include mold flash. maximum mold flash 0.25 (0.010). dim min max min max millimeters inches a 1.435 1.465 36.45 37.21 b 0.540 0.560 13.72 14.22 c 0.155 0.200 3.94 5.08 d 0.014 0.022 0.36 0.56 f 0.032 0.046 0.81 1.17 g 0.070 bsc 1.778 bsc h 0.300 bsc 7.62 bsc j 0.008 0.015 0.20 0.38 k 0.115 0.135 2.92 3.43 l 0.600 bsc 15.24 bsc m 0 15 0 15 n 0.020 0.040 0.51 1.02 42 1
1323 motorola analog ic device data fb, ftb suffix case 873-01 plastic package (tqfp32) issue a 1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane h is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums a, b and d to be determined at datum plane h. 5. dimensions s and v to be determined at seating plane c. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.25 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane h. 7. dimension d does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the d dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. u b l detail a l a 32 25 24 16 17 18 9 v s ab m 0.20 (0.008) d s c s ab m 0.20 (0.008) d s h ab 0.05 (0.002) s ab m 0.20 (0.008) d s c ab 0.05 (0.002) s ab m 0.20 (0.008) d s h d a s b c seating plane h datum plane m g detail c m h c e 0.01 (0.004) h datum plane t detail c r k q x detail a b b p a, b, d s ab m 0.20 (0.008) d s c j f n d section bb base metal view rotated 90 clockwise dim min max min max inches millimeters a 6.95 0.274 0.280 b 6.95 7.10 0.274 0.280 c 1.40 1.60 0.055 0.063 d 0.273 0.373 0.010 0.015 e 1.30 1.50 0.051 0.059 f 0.273 0.010 g 0.80 bsc 0.031 bsc h 0.20 0.008 j 0.119 0.197 0.005 0.008 k 0.33 0.57 0.013 0.022 l 5.6 ref 0.220 ref m 6 8 6 8 n 0.119 0.135 0.005 0.005 p 0.40 bsc 0.016 bsc q 5 10 5 10 r 0.15 0.25 0.006 0.010 s 8.85 9.15 0.348 0.360 t 0.15 0.25 0.006 0.010 u 5 11 5 11 v 8.85 9.15 0.348 0.360 x 1.00 ref 0.039 ref 7.10
1324 motorola analog ic device data t suffix case 894-03 plastic package (23-pin szip) issue b 1 23 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension r does not include mold flash or protrusions. 4. dimension b does not include mold flash or protrusions. 5. mold flash or protrusions shall not exceed 0.010 (0.250). 6. dimension d does not include dambar protrusion. allowable protrusion shall be 0.003 (0.076) total in excess of the d dimension at maximum material condition. dim a min max min max millimeters 0.684 0.694 17.374 17.627 inches b 1.183 1.193 30.048 30.302 c 0.175 0.179 4.445 4.547 d 0.026 0.031 0.660 0.787 e 0.058 0.062 1.473 1.574 f 0.165 0.175 4.191 4.445 g 0.050 bsc 1.270 bsc h 0.169 bsc 4.293 bsc j 0.014 0.020 0.356 0.508 k 0.625 0.639 15.875 16.231 l 0.770 0.790 19.558 20.066 m 0.148 0.152 3.760 3.861 n 0.148 0.152 3.760 3.861 p 0.390 bsc 9.906 bsc r 0.416 0.424 10.566 10.770 s 0.157 0.167 3.988 4.242 u 0.105 0.115 2.667 2.921 v 0.868 ref 22.047 ref w 0.200 bsc 5.080 bsc y 0.700 0.710 17.780 18.034 pin 1 d n m a p l b f u r g pin 23 23x s q m 0.010 (0.254) n s t y k v h s e c w m 0.024 (0.610) t j 23x t seating plane
1325 motorola analog ic device data fta suffix case 93202 plastic package (tqfp48) issue d dim a min max min max inches 7.000 bsc 0.276 bsc millimeters a1 3.500 bsc 0.138 bsc b 7.000 bsc 0.276 bsc b1 3.500 bsc 0.138 bsc c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.500 basic 0.020 basic h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.500 0.700 0.020 0.028 m 12 ref 12 ref n 0.090 0.160 0.004 0.006 p 0.250 basic 0.010 basic q 1 5 1 5 r 0.150 0.250 0.006 0.010 s 9.000 bsc 0.354 bsc s1 4.500 bsc 0.177 bsc v 9.000 bsc 0.354 bsc v1 4.500 bsc 0.177 bsc w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u, and z to be determined at datum plane ab. 5. dimensions s and v to be determined at seating plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.250 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). 8. minimum solder plate thickness shall be 0.0076 (0.0003). 9. exact shape of each corner is optional. ??? ??? ??? a a1 t z 0.200 (0.008) ab tu u 4x z 0.200 (0.008) ac tu 4x b b1 1 12 13 24 25 36 37 48 z s1 s v v1 p ae ae t, u, z detail y detail y base metal n j f d s tu m 0.080 (0.003) z s ac section aeae ab ac ad g 0.080 (0.003) ac m top & bottom q w k x e c h 0.250 (0.010) gauge plane r 9 detail ad 48 1
1326 motorola analog ic device data d2t suffix case 93603 plastic package issue b d2t suffix case 936a02 plastic package (d 2 pak) issue a v u terminal 4 a 12 3 k f b j s h d g c m 0.010 (0.254) t e m l p n r t optional chamfer 5 ref a 123 k b s h d g c e m l p n r v u terminal 6 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. tab contour optional within dimensions a and k. 4. dimensions u and v establish a minimum mounting surface for terminal 6. 5. dimensions a and b do not include mold flash or gate protrusions. mold flash and gate protrusions not to exceed 0.025 (0.635) maximum. dim a min max min max millimeters 0.386 0.403 9.804 10.236 inches b 0.356 0.368 9.042 9.347 c 0.170 0.180 4.318 4.572 d 0.026 0.036 0.660 0.914 e 0.045 0.055 1.143 1.397 g 0.067 bsc 1.702 bsc h 0.539 0.579 13.691 14.707 k 0.050 ref 1.270 ref l 0.000 0.010 0.000 0.254 m 0.088 0.102 2.235 2.591 n 0.018 0.026 0.457 0.660 p 0.058 0.078 1.473 1.981 r 5 ref s 0.116 ref 2.946 ref u 0.200 min 5.080 min v 0.250 min 6.350 min 45 m 0.010 (0.254) t t optional chamfer 5 ref 5 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. tab contour optional within dimensions a and k. 4. dimensions u and v establish a minimum mounting surface for terminal 4. 5. dimensions a and b do not include mold flash or gate protrusions. mold flash and gate protrusions not to exceed 0.025 (0.635) maximum. dim a min max min max millimeters 0.386 0.403 9.804 10.236 inches b 0.356 0.368 9.042 9.347 c 0.170 0.180 4.318 4.572 d 0.026 0.036 0.660 0.914 e 0.045 0.055 1.143 1.397 f 0.051 ref 1.295 ref g 0.100 bsc 2.540 bsc h 0.539 0.579 13.691 14.707 j 0.125 max 3.175 max k 0.050 ref 1.270 ref l 0.000 0.010 0.000 0.254 m 0.088 0.102 2.235 2.591 n 0.018 0.026 0.457 0.660 p 0.058 0.078 1.473 1.981 r s 0.116 ref 2.946 ref u 0.200 min 5.080 min v 0.250 min 6.350 min 1 2 3 1 5
1327 motorola analog ic device data dt, dtb suffix case 948e02 plastic package (tssop20) issue a dtb suffix case 948f01 plastic package (tssop16, tssop16l) issue o dim a min max min max inches 6.60 0.260 millimeters b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.27 0.37 0.011 0.015 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 1 10 11 20 pin 1 ident a b t 0.100 (0.004) c d g h section nn k k1 jj1 n n m f w seating plane v u s u m 0.10 (0.004) v s t 20x ref k l l/2 2x s u 0.15 (0.006) t detail e 0.25 (0.010) detail e 6.40 0.252 s u 0.15 (0.006) t ??? ??? ??? dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.18 0.28 0.007 0.011 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane w. section nn seating plane ident. pin 1 1 8 16 9 detail e j j1 b c d a k k1 h g detail e f m l 2x l/2 u s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) t v w 0.25 (0.010) 16x ref k n n notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane w. 1 20 1 16
1328 motorola analog ic device data dtb suffix case 948g01 plastic package (tssop14) issue o 1 14 dim min max min max inches millimeters a 4.90 5.10 0.193 0.200 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4 dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5 dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6 terminal numbers are shown for reference only. 7 dimension a and b are to be determined at datum plane w. s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l u seating plane 0.10 (0.004) t ??? ??? section nn detail e j j1 k k1 detail e f m w 0.25 (0.010) 8 14 7 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t v 14x ref k n n
1329 motorola analog ic device data dtb suffix case 948h01 plastic package issue o dim min max min max inches millimeters a 7.70 7.90 0.303 0.311 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.27 0.37 0.011 0.015 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4. dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5. dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6. terminal numbers are shown for reference only. 7. dimension a and b are to be determined at datum plane w. s u 0.15 (0.006) t 2x l/2 s u m 0.10 (0.004) v s t l u seating plane 0.10 (0.004) t ??? ??? section nn detail e j j1 k k1 detail e f m w 0.25 (0.010) 13 24 12 1 pin 1 ident. h g a d c b s u 0.15 (0.006) t v 24x ref k n n 1 24
1330 motorola analog ic device data dtb suffix case 948j01 plastic package (tssop8) issue o 1 8 ??? ??? dim min max min max inches millimeters a 2.90 3.10 0.114 0.122 b 4.30 4.50 0.169 0.177 c 1.20 0.047 d 0.05 0.15 0.002 0.006 f 0.50 0.75 0.020 0.030 g 0.65 bsc 0.026 bsc h 0.50 0.60 0.020 0.024 j 0.09 0.20 0.004 0.008 j1 0.09 0.16 0.004 0.006 k 0.19 0.30 0.007 0.012 k1 0.19 0.25 0.007 0.010 l 6.40 bsc 0.252 bsc m 0 8 0 8 notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimension a does not include mold flash. protrusions or gate burrs. mold flash or gate burrs shall not exceed 0.15 (0.006) per side. 4 dimension b does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.25 (0.010) per side. 5 dimension k does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the k dimension at maximum material condition. 6 terminal numbers are shown for reference only. 7 dimension a and b are to be determined at datum plane w. section nn seating plane ident. pin 1 1 4 8 5 see detail e j j1 b c d a k k1 h g detail e f m l 2x l/2 u s u 0.15 (0.006) t s u 0.15 (0.006) t s u m 0.10 (0.004) v s t 0.10 (0.004) t v w 0.25 (0.010) 8x ref k n n m suffix case 96701 plastic package (eiaj20) issue o dim min max min max inches 2.05 0.081 millimeters 0.05 0.20 0.002 0.008 0.35 0.50 0.014 0.020 0.18 0.27 0.007 0.011 12.35 12.80 0.486 0.504 5.10 5.45 0.201 0.215 1.27 bsc 0.050 bsc 7.40 8.20 0.291 0.323 0.50 0.85 0.020 0.033 1.10 1.50 0.043 0.059 0 0.70 0.90 0.028 0.035 0.81 0.032 a 1 h e q 1 l e 10 0 10 notes: 1 dimensioning and tolerancing per ansi y14.5m, 1982. 2 controlling dimension: millimeter. 3 dimensions d and e do not include mold flash or protrusions and are measured at the parting line. mold flash or protrusions shall not exceed 0.15 (0.006) per side. 4 terminal numbers are shown for reference only. 5 the lead width dimension (b) does not include dambar protrusion. allowable dambar protrusion shall be 0.08 (0.003) total in excess of the lead width dimension at maximum material condition. dambar cannot be located on the lower radius or the foot. minimum space between protrusions and adjacent lead to be 0.46 ( 0.018). h e a 1 l e q 1 c a z d e 20 110 11 b m 0.13 (0.005) e 0.10 (0.004) view p detail p m l a b c d e e l m z 1 20
1331 motorola analog ic device data ftb suffix case 97601 plastic package (tqfp20) issue o dim min max min max inches millimeters a 4.000 bsc 0.157 bsc a1 2.000 bsc 0.079 bsc b 4.000 bsc 0.157 bsc b1 2.000 bsc 0.079 bsc c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.650 bsc 0.026 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.500 0.700 0.020 0.028 m 12 ref 12 ref n 0.090 0.160 0.004 0.006 p 0.250 bsc 0.010 bsc q 1 5 1 5 r 0.150 0.250 0.006 0.010 s 6.000 bsc 0.236 bsc s1 3.000 bsc 0.118 bsc v 6.000 bsc 0.236 bsc v1 3.000 bsc 0.118 bsc w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u, and z to be determined at datum plane ab. 5. dimensions s and v to be determined at datum plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.250 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). 8. minimum solder plate thickness shall be 0.0076 (0.0003). 9. exact shape of each corner is optional. detail ad detail y 4x 4x 1 5 6 11 16 10 15 20 s s1 a a1 u tu 0.200 (0.008) z ab 9 b b1 t v v1 z tu 0.200 (0.008) z ab ac ab 0.080 (0.003) ac r detail ad detail y ae ae k x w g top & bottom section aeae m q ce h 0.250 (0.010) gauge plane ???? ???? ???? f d n j t, u, z s tu s 0.080 (0.003) z s ac 1 20
1332 motorola analog ic device data fta suffix case 97701 plastic package issue o dim min max min max inches millimeters a 4.000 bsc 0.157 bsc a1 2.000 bsc 0.079 bsc b 4.000 bsc 0.157 bsc b1 2.000 bsc 0.079 bsc c 1.400 1.600 0.055 0.063 d 0.170 0.270 0.007 0.011 e 1.350 1.450 0.053 0.057 f 0.170 0.230 0.007 0.009 g 0.500 bsc 0.020 bsc h 0.050 0.150 0.002 0.006 j 0.090 0.200 0.004 0.008 k 0.500 0.700 0.020 0.028 m 12 ref 12 ref n 0.090 0.160 0.004 0.006 p 0.250 bsc 0.010 bsc q 1 5 1 5 r 0.150 0.250 0.006 0.010 s 6.000 bsc 0.236 bsc s1 3.000 bsc 0.118 bsc v 6.000 bsc 0.236 bsc v1 3.000 bsc 0.118 bsc w 0.200 ref 0.008 ref x 1.000 ref 0.039 ref notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. datum plane ab is located at bottom of lead and is coincident with the lead where the lead exits the plastic body at the bottom of the parting line. 4. datums t, u, and z to be determined at datum plane ab. 5. dimensions s and v to be determined at datum plane ac. 6. dimensions a and b do not include mold protrusion. allowable protrusion is 0.250 (0.010) per side. dimensions a and b do include mold mismatch and are determined at datum plane ab. 7. dimension d does not include dambar protrusion. dambar protrusion shall not cause the d dimension to exceed 0.350 (0.014). 8. minimum solder plate thickness shall be 0.0076 (0.0003). 9. exact shape of each corner is optional. detail ad detail y 4x 4x 1 6 7 13 19 12 18 24 s s1 a a1 u tu 0.200 (0.008) z ab 9 b b1 t v v1 z tu 0.200 (0.008) z ab ac ab 0.080 (0.003) ac r detail ad detail y ae ae k x w g top & bottom section aeae m q ce h 0.250 (0.010) gauge plane ???? ???? ???? f d n j t, u, z p s tu s 0.080 (0.003) z s ac 1 24
1333 motorola analog ic device data n suffix case 121201 plastic package (sot23) issue o 1 dim min max millimeters a1 0.00 0.10 a2 1.00 1.30 b 0.30 0.50 c 0.10 0.25 d 2.80 3.00 e 2.50 3.10 e1 1.50 1.80 e 0.95 bsc e1 1.90 bsc l l1 0.45 0.75 notes: 1. dimensions are in millimeters. 2. interpret dimensions and tolerances per asme y14.5m, 1994. 3. datum c is a seating plane. a 1 5 23 4 d e1 b l1 e e e1 c m 0.10 c s b s a b 5x a2 a1 s 0.05 c l 0.20 h suffix case 121301 plastic package (sot89) issue o 1 dim min max millimeters a2 1.40 1.60 b 0.37 0.57 b1 0.32 0.52 c 0.30 0.50 d 4.40 4.60 d1 1.50 1.70 e 4.25 e1 2.40 2.60 e 1.50 bsc e1 3.00 bsc l1 0.80 notes: 1. dimensions are in millimeters. 2. interpret dimensions and tolerancing per asme y14.5m, 1994. 3. datum c is a seating plane. a d e1 b l1 e d1 e e1 c m 0.10 c s b s a m 0.10 c s b s a b b1 2x a2 c

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